VIA Technologies AMOS-5000-1MSZA1 Chassis Kit

Description

AMOS Embedded Chassis for EITX-3000 Em-ITX Board, with 2× HDD Bay

The VIA AMOS-5000 modular chassis kit is designed to take advantage of boards based on the VIA-developed Em-ITX form factor, making it easy to create a range of highly versatile, fanless, rugged and easy to assemble IPC design for a range of embedded applications.

The VIA AMOS-5000 chassis kit takes advantage of the unique features that Em-ITX brings to the embedded market, including a rich I/O feature set along both sides of the board through unique dual I/O coastlines, an EMIO bus which uses both legacy and modern bus technologies to work with a range of Em-ITX expansion modules in a variety of application specific I/O configurations.

Systems built using the VIA AMOS-5000 chassis kit are completely fanless and withstand a wide temperature range of -20°c to 55°c. Capable of sustaining a g-force of up to 50, VIA AMOS-5000 chassis are easily assembled and maintained, using only five mechanical pieces to form a robust, fanless system with extensive I/O options.

Key Features include:

Fanless operation from -20°C up to 55°C
Easy, quick installation and maintenance with only five parts
Shock resistant up to 50G with vibration resistant design to ensure extended reliability
Modularized design with compact dimensions: 232mm(W) x 53mm(H) x 126mm(D)
Easy to use inter-changeable and customizable front and rear panels
Built-in common I/O functional feature cutouts for easy external access
Maximum space efficiency for optimized electromagnetic compatibility

The VIA AMOS-5000 is currently paired with the VIA EITX-3000 board, the first Em-ITX board on the market, targeting a wide variety of embedded segments including medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveilLANce applications.