Description
- Form Factor: Evaluation Kit
- Chipset: Broadcom BCM43362 + STM32F3
- Wireless Standard: 802.11bgn
- Frequency: 2.4GHz
- Antenna: 1×1 MIMO (1Tx1R)
This Design Kit Provides Out-of-the-Box Device connectivity to the Cloud, and Enables Rapid Prototyping of Cloud-Connected Products
What comes with my Design Kit:
- ST Microelectronics STM32F3 host MCU
- USI BM09A Wi-Fi Ayla Connectivity Module
- Access to the Ayla Developer and Support Portals
- Smartphone Demo Applications for iOS and Android Devices


