Description
- Form Factor: Evaluation Kit
- Chipset: Broadcom BCM43362 + STM32F3
- Wireless Standard: 802.11bgn
- Frequency: 2.4GHz
- Antenna: 1×1 MIMO (1Tx1R)
This Design Kit Provides Out-of-the-Box Device connectivity to the Cloud, and Enables Rapid Prototyping of Cloud-Connected Products.
What comes with my Design Kit:
o ST Microelectronics STM32F3 host MCU
o USI BM09A Wi-Fi Ayla Connectivity Module
o Access to the Ayla Developer and Support Portals
o Smartphone Demo Applications for iOS and Android Devices
o USB to 3.3v TTL Header FTDI TTL-232R-3V3 Cable
