USI WM-BAC-BM-25-UFL 802.11ac/abgn + Bluetooth SiP Module | Broadcom BCM43455

USI WM-BAC-BM-25-UFL 802.11ac/abgn + Bluetooth SiP Module | Broadcom BCM43455

Broadcom/Cypress 802.11ac/abgn Wi-Fi + BT 4.2 LGA SiP module | u.FL RF connector

$12.50

  • Note: The listed price includes all applicable import duties and tariffs—no hidden fees at checkout.

Description

  • Form Factor: SiP Module
  • Chipset: Broadcom BCM43455
  • Wireless Standard: 802.11ac/abgn + BT
  • Frequency: 2.4 GHz/5 GHz, Dualband
  • Antenna: 1×1 MIMO (1T×1R)

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Features

  • Broadcom/Cypress BCM43455 SiP Module
  • Dual Band Wi-Fi 802.11ac/abgn + Bluetooth BLE 4.2 Smart Ready
  • I/O: SDIO 3.0 (Wi-Fi) + UART (Bluetooth)
  • Form Factor: 65 pin LGA (15 mm × 10 mm × 1.8 mm)
  • On Board u.FL RF connector

Additional information

Weight 0.07 lbs
Dimensions 0.35 × 0.28 × 0.05 in
Chipset Maker

Broadcom
RF Connector

u.FL/I-PEX
Brand

USI
Model Number

WM-BAC-BM-25-UFL
Dimensions

8.8 mm × 7.2 mm × 1.2 mm
Temperature

–10 °C to 65 °C
WLAN Form Factor

SiP Module
Chipset Model

BCM43455
Chipset

Broadcom BCM43455
Wi-Fi Frequency

Dual-Band
Wireless Standard

802.11ac/abgn + BT
MIMO

1×1

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