Description
- Form Factor: SiP Module
- Chipset: Broadcom BCM43455
- Wireless Standard: 802.11ac/abgn + BT
- Frequency: 2.4/5 GHz dual-band
- Antenna: 1×1 MIMO (1T×1R)
Features
- Broadcom/Cypress BCM43455 SiP Module
- Dual-band and Wi-Fi 802.11ac/abgn + Bluetooth BLE 4.2 Smart Ready
- I/O: SDIO 3.0 (Wi-Fi) + UART (Bluetooth)
- Form Factor: 72-pin LGA (7.9 mm × 7.3 mm ×1.1 mm)
- Also see WM-BAC-BM-25 (Chip Antenna) and BM-25-UFL (U.FL connector)


