Compex WSD377 802.11ac/abgn + Bluetooth SiP Module | Qualcomm QCA9377-3

Compex WSD377 802.11ac/abgn + Bluetooth SiP Module | Qualcomm QCA9377-3

2.4/5 GHz Wi-Fi + Bluetooth LGA module designed for WLAN/BT and low-energy communications

$23.00

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Description

  • Form Factor: SiP Module
  • Chipset: Qualcomm QCA9377-7
  • Wireless Standard: 802.11ac/abgn + BT
  • Frequency: 2.4/5GHz, Dualband
  • Antenna: 1×1 MIMO (1Tx1R)


Features

  • Chipset: Qualcomm Atheros QCA9377-3
  • 802.11ac Wave 2 dual-band LGA module
  • Dimension: 12mm x 12mm x 1.5mm
  • Interface: Low-power SDIO 3.0
  • Bluetooth 4.2 + HS, BLE, and ANT+ and backward compatibility with BT 1.x and BT 2.x + Enhanced Data Rate
  • 3.3V DC power supply and I/O supply of 1.8V or 3.3V

Additional information

Weight 0.07 lbs
Dimensions 0.47 × 0.47 × 0.06 in
Chipset Maker

Qualcomm
Interface Connector

LGA
RF Connector

Pad Interface
Brand

Compex
Model Number

WSD377
Dimensions

12 mm × 12 mm × 1.5 mm
Temperature

–20 °C to 70 °C
WLAN Form Factor

SiP Module
Chipset Model

QCA9377-7
Chipset

Qualcomm QCA9377-3
Wi-Fi Frequency

Dual-Band
Wireless Standard

802.11ac/abgn + BT
MIMO

1×1
Host Interface

SDIO