$39.99
The SparkLAN/Ampak AP6275HH3 is the first PCIe-based Wi-Fi-6 (802.11ax) combo module from Synaptic/Broadcom. This module supports DBDC (dual-band dual-concurrent), enabling concurrent connections to multiple different frequencies (2.4 GHz and 5 GHz). AP6275HH3 supports full IEEE802.11 ax/ac/a/b/g/n protocol, with Wi-Fi running PCIe (v3.0) interface, and BT through UART/PCM interface.
AP6275HH3 designed with 2 spatial streams (2T2R, or 2×2) in MU-MIMO mode with a SiP packaging form-factor of 24 mm × 24 mm.
Software wise AP6275HH3 support Linux and Android in the near future. The module is capable to run on both x86 platform and ARM based platform, and supports STA mode and basic Soft AP Mode, recommend running on application includes: digital signage/POS, tablets, and other media consumption application (Consumer and commercial use) that requires high speed data transmission.
| Weight | 0.12 lbs |
|---|---|
| Dimensions | 0.94 × 0.94 × 0.08 in |
| Temperature | Operating: –30 °C to 85 °C (–22 °F to 185 °F); Storing: –40 °C to 85 °C (–40 °F to 185 °F) |
| Interface Connector | WLAN: SDIO v2.0/3.0; Bluetooth 5.0: UART/PCM |
| Chipset Maker | Broadcom |
| Interface Connector | SDIO, UART |
| RF Connector | External Antenna |
| Model Number | AP6275HH3 |
| Brand | SparkLAN |
| Dimensions | 24 mm × 24 mm × 2.1 mm |
| WLAN Form Factor | SiP Module |
| Chipset Model | BCM43752 |
| Chipset | Broadcom BCM43752 |
| Wi-Fi Frequency | Dual-Band |
| Wireless Standard | 802.11ax (Wi-Fi 6) + BT |
| MIMO | 2×2 |
| Host Interface | PCM, SDIO, UART |
| RF Output Summary | 19 dBm |
| Certifications | REACH (EU), RoHS (EU) |
