$27.99
AP6275P is an 802.11ax (Wi-Fi 6) SiP module, allowing increased capacity, faster speed, better coverage connections, and improves the battery life of IoT sensors, which extends the benefits of Wi-Fi 6 to the broader smartphone market where high performance and total solution cost are equally important design considerations. AP6275P is a highly integrated chip that brings together the latest innovations in Wi-Fi 6 to offer smartphone makers a cost effective, high-performance connectivity solution.
It supports key Wi-Fi 6 innovations including OFDMA and MU-MIMO technologies for better performance in crowded environments, advanced roaming capabilities, and WPA3 security protocols. The Wi-Fi functionalities module has seamless roaming capabilities and advanced security, as well as a PCIe v3.0 interface for Wi-Fi.
| Weight | 0.12 lbs |
|---|---|
| Dimensions | 0.59 × 0.51 × 0.06 in |
| Temperature | Operating: –30 °C to 85 °C (–22 °F to 185 °F); Storing: –40 °C to 105 °C (–40 °F to 221 °F) |
| Interface Connector | WLAN: mPCIe; Bluetooth 5.0: UART/PCM |
| Chipset Maker | Broadcom |
| Interface Connector | UART, mPCIe |
| RF Connector | External Antenna |
| Model Number | AP6275P |
| Brand | SparkLAN |
| Dimensions | 15 mm × 13 mm × 1.55 mm |
| WLAN Form Factor | SiP Module |
| Chipset Model | BCM43752 |
| Chipset | Broadcom BCM43752 |
| Wi-Fi Frequency | Dual-Band |
| Wireless Standard | 802.11ax (Wi-Fi 6) + BT |
| MIMO | 2×2 |
| Host Interface | PCM, SDIO, UART |
| RF Output Summary | 19 dBm |
| Certifications | REACH (EU), RoHS (EU) |
| Memory | 4 GB |
