Compex Wi-Fi 7 Dual Band Wireless Module | mPCIe | 802.11be (Wi-Fi 7) | 2×2 | Qualcomm QCN6224 | WLE7002E25 7A000TXL

mPCIe form factor

📶 Next-Gen Wi-Fi 7 Performance: Supports cutting-edge features like 4096-QAM and OFDMA for unmatched speed and efficiency.

🌐 Wide Compatibility: Seamlessly integrates with Qualcomm, Intel x86, and ARM platforms for flexible applications.

📡 Simplified Antenna Design: Utilizes a diplexer to merge 2.4GHz and 5GHz signals into a single antenna for streamlined installation.

$156.00

Description

The WLE7002E25 Dual-Band Wi-Fi 7 mPCIe Module is a state-of-the-art solution designed for enterprise, industrial, and commercial-grade applications. Powered by Qualcomm’s QCN6224, this module supports the latest Wi-Fi 7 (802.11be) standard with 2×2 MU-MIMO functionality across 2.4 GHz and 5 GHz bands. Its diplexer technology combines both frequency bands into a single antenna, simplifying deployment while maintaining robust performance.

Delivering up to 688Mbps on 2.4 GHz and 4324 Mbps on 5 GHz, the WLE7002E25 is perfect for environments demanding high-speed, low-latency wireless communication. Its multi-link operation (MLO) and preamble puncturing capabilities enhance spectral efficiency and throughput, ensuring optimal performance even in legacy device networks. With an operating temperature range of -20°C to 70°C, this module meets the demands of both commercial and industrial environments.

This versatile solution integrates seamlessly with third-party platforms, including Intel x86 and ARM processors, ensuring compatibility across a wide range of devices.

Key Features:

  • Dual-band MU-MIMO: Supports concurrent 2.4 GHz and 5 GHz operation with up to 4096-QAM for improved throughput.
  • High-speed performance: Up to 688 Mbps on 2.4 GHz and 4324 Mbps on 5GHz, with support for 20-240 MHz channels.
  • Advanced spectral efficiency: Features multi-link operation (MLO) and preamble puncturing for enhanced performance.
  • Highly adaptable: Compatibility with multiple ecosystems, including Qualcomm, Intel, and ARM.
  • Energy-efficient design: Operates at 8 W with a 3.3 V power supply for reduced energy consumption.

Additional information

Weight 0.05 lbs
Dimensions 1.18 × 2 × 0.51 in
Brand

Compex

Model Number

WLE7002E25 7A000SXLF

RF Connector

u.FL/I-PEX

Dimensions

30 mm × 50.8 mm × 13 mm (1.18 in. × 2 in. × 0.51 in.)

Temperature

–20 °C to 70 °C (–4 °F to 158 °F)

WLAN Form Factor

mPCIe

Chipset Model

QCN6274

Chipset

Qualcomm QCN6274

Interface Connector

Wi-Fi: PCIe v3.0

Certifications

REACH (EU), RoHS (EU)

Wi-Fi Frequency

Dual-Band

MIMO

2×2

Wireless Standard

802.11be (Wi-Fi 7)

Application

Enterprise and Industrial

Bluetooth

No

Host Interface

PCI

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