Compex Wi-Fi 7 Dual Band Wireless Module with Diplexer | mPCIe | 802.11be (Wi-Fi 7) | 2×2 | Qualcomm QCN6274 | WLE7002E26 7A000SXLF

🚀High-Performance Connectivity: Provides up to 688 Mbps on 2.4 GHz and 5765 Mbps on 6 GHz for demanding applications.

🔹Enhanced Efficiency: Features like OFDMA and multi-link operation reduce latency and improve spectral efficiency.

🔋 Power-Efficient Design: Operates at 8.3 W max with a 3.3 V power supply for optimized energy consumption.

🔧Simplified Deployment: Diplexer technology supports dual-band operation with a single antenna for easier integration.

$208.00

  • Note: The listed price includes all applicable import duties and tariffs—no hidden fees at checkout.

Description

The WLE7002E26 Dual-Band Wi-Fi 7 Module is a powerful networking solution that combines advanced 2.4 GHz and 6 GHz connectivity into a single compact design. Powered by Qualcomm’s QCN6274 chipset, this 2×2 MU-MIMO Wi-Fi 7 (802.11be) module delivers outstanding performance for enterprise, industrial, and small-to-medium business (SMB) applications. The built-in diplexer technology reduces the need for multiple antennas, streamlining deployment without compromising functionality.

Capable of delivering up to 688 Mbps on 2.4 GHz and 5765 Mbps on 6 GHz, the WLE7002E26 is an ideal choice for high-bandwidth and low-latency requirements. Its multi-link operation (MLO) support reduces latency and aggregates throughput, while features like preamble puncturing enhance spectral efficiency in environments with legacy users. Designed with a 3.3 V power-efficient architecture, it ensures reliable, long-term operation. Additionally, the module supports both AP and STA modes, allowing simultaneous backhaul and client connectivity.

Key Features:

  • Dual-band MU-MIMO: Simultaneous 2.4 GHz and 6 GHz operation with high throughput and wide coverage.
  • Advanced Wi-Fi 7 features: Supports 4096-QAM, OFDMA, MLO, and preamble puncturing for enhanced efficiency.
  • Cost-effective design: Integrated diplexer eliminates the need for multiple antennas.
  • Flexible ecosystem compatibility: Works seamlessly with Qualcomm, Intel x86, and ARM processors.
  • Rugged and reliable: Operates efficiently in temperatures ranging from -20°C to 70°C

Additional information

Weight 0.05 lbs
Dimensions 1.18 × 2 × 0.51 in
Brand

Compex

Model Number

WLE7002E26 7A000SXLF

RF Connector

u.FL/I-PEX

Dimensions

30 mm × 50.8 mm × 13 mm (1.18 in. × 2 in. × 0.51 in.)

Temperature

–20 °C to 70 °C (–4 °F to 158 °F)

WLAN Form Factor

mPCIe

Chipset Model

QCN6274

Chipset

Qualcomm QCN6274

Interface Connector

Wi-Fi: PCIe v3.0

Certifications

REACH (EU), RoHS (EU)

Wi-Fi Frequency

Dual-Band

MIMO

2×2

Wireless Standard

802.11be (Wi-Fi 7)

Application

Commercial Grade

Bluetooth

No

Host Interface

PCI

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