Embedded Works BH676CP

Description

• Wireless Standard: Bluetooth BLE 4.1
• Form Factor:
• Chipset: Toshiba TC35676
• Frequency: 2.4GHz
• Operating Temperature: -40C to +85C

Features

• Standalone or used with a host MCU by UART interface/HCI Commands
• Bluetooth SIG certified BLE 4.1 stacks embedded in 256 KB mask-ROM.
• Toshiba SOC, built-in ARM7TDMI-S processor
• 256KB mask-ROM for Bluetooth stacks
• 224KB RAM
• 256KB flash, for Bluetooth profiles, user data and applications
• Bluetooth RF analog core, baseband digital core and integrated antenna
• Transmitter power 0 dBm; Receiver sensitivity: -91 dBm.
• Bluetooth Low Energy (BLE) V4.1 GATT profile with OTA (Over The Air) support.
• Up to15 General Purpose IOs to be configured by firmware:
• SPI interface, I2C interface
• UART interface, 9600bps to 921.6 Kbps
• Up to 2 wake up interfaces
• Up to 3 ADC channels (1 for internal monitoring of VDD).
• Up to 3 PWM channels
• On board 26 MHz main clock
• External 32.768 kHz sleep clock
• Operation voltage: 2.0V-3.6V
• Peak current consumption, 6 mA; deep sleep mode <0.1uA
• Integrated PCB trace antenna,
• Bluetooth line of sight range with a smartphone, 20 meters (60 feet).
• Operation Temperature: -40oC to +85oC
• Dimension: 17.7x11x1.9mm
• Castellated pins: 24 pins. Easier prototyping, easier production.
• Integrated shield to resist EMI
• FCC ID: X8WBH676CP
• Bluetooth SIG QDID: 66367 (Toshiba)

Applications:

• Wearable
• Access Points
• Industrial Control
• Medical
• Scanners
• iOS and Android devices
• Wireless sensors
• Cable replacement
• Instrumentation
• Automobile