Description
The Telit LE910C4-AP Translation Board (MPN: 3990252045) leverages the robust capabilities of the Telit LE910C4-AP LTE Category 4 module, making it an ideal platform for a wide array of Internet of Things (IoT) applications and mobile data and computing devices requiring high-speed connectivity in the Asia-Pacific (APAC) market. This module is compliant with the 3GPP Release 10 standards, offering peak data rates of 150 Mbps downlink and 50 Mbps uplink, with DC-HSPA+ fallback speeds up to 42 Mbps where 3G is still prevalent. Designed with a focus on longevity and cost-efficiency, the LE910C4-AP is part of the xE910 Unified Form Factor Family, ensuring pin-to-pin compatibility and a common software interface with other Telit 2G, 3G, and 4G modules. This “design once, use anywhere” philosophy allows for simplified migration and technology reuse, protecting investments in development and certification across different regional variants or technology generations. The module’s robust design includes an extended operating temperature range of -40 °C to +85 °C, making it suitable for deployment in harsh industrial environments such as utility metering, home and commercial security systems, and various fleet management solutions.
Key technical specifications highlight the module’s advanced features, which include LTE FDD Cat.4, Rx Diversity, and MIMO DL 2×2. It supports a comprehensive range of APAC frequency bands, specifically B1 (2100), B3 (1800), B5 (850), B8 (900), B9 (1800), B18/B26 (800/850), B19 (800), and B28 (700) for 4G LTE, alongside multiple 3G bands (B1, B5, B6, B19, B8). The LE910C4-AP is also equipped with simultaneous support for multiple global navigation satellite systems (GNSS), including GPS, Glonass, Bei-dou, Galileo, and QZSS, providing reliable location services critical for mobile and tracking applications. Integration with peripherals and actuators is straightforward via interfaces such as USB 2.0 HS, UART, and user-definable GPIOs. Furthermore, the module is Internet-friendly, featuring built-in UDP/TCP/FTP/SMTP stacks and IPv4/IPv6 support. The translation board variant, specifically intended for APAC, provides a convenient Mini PCIe full-size form factor for easy integration into host devices, alongside a Mini (2FF) SIM-slot for connectivity. Its foundation on the best-in-class Qualcomm MDM9207 platform ensures high performance and reliability, while compliance with global regulatory approvals, including RoHS and REACH, confirms its adherence to environmental standards.
