Telit Interface/Translation Board (TLB) for FN990 Module Development | Rev. C w/o module | 3990252325

🔧 Development Tool: Interface board (TLB) used for rapid development with a Telit FN990 module.

💻 Seamless Integration: Designed for use with a Telit FN990 module and a separately purchased Telit EVB 2.0 Board.

🔌 Power Compatibility: Works with the Telit FN990 module, which supports 5G sub-6 FDD and TDD SA/NSA operations.

🌏 Global Reach: Enables the use of the FN990 module for global 5G sub-6 deployment.

📣 Next-Gen 5G: Supports next-generation 5G data cards leveraging technologies like the Qualcomm Snapdragon X65/X62 5G Modem-RF system.

$1,000.00

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Description

The Telit FN990 Interface TLB Rev. C w/o module is an essential component designed to facilitate the rapid development and testing of products utilizing the Telit FN990 5G module. Known as a Translation or Interface Board (TLB), this particular component acts as an intermediary, allowing the high-performance FN990 5G module to interface seamlessly with a separate Telit EVB 2.0 Board (purchased separately). This configuration is critical for engineers and developers seeking to evaluate the capabilities and integrate the functionalities of the powerful FN990 series into their new devices efficiently. The use of this Interface TLB significantly simplifies the prototyping phase, ensuring quick and reliable connections necessary for comprehensive testing of 5G sub-6 capabilities. This board’s design, specifically Rev. C, supports the robust integration required for handling advanced features like 5G 3GPP Rel 17 sub-6 FDD and TDD, SA and NSA operations, and extensive 4G support including 7-CA up to 20 layers DL.

This Interface TLB is specifically designed “w/o module,” meaning it provides the necessary infrastructure and connectors for a Telit FN990 5G module (which must be acquired separately) to be installed. This design choice offers flexibility, allowing developers to pair the interface board with the specific FN990 variant they are focused on. The FN990 series is a highly capable platform, supporting advanced mobile broadband features. For instance, the associated FN990 family supports 4×4 MIMO DL across all 4G and 5G MHB and UHF bands, with 2×2 MIMO DL support on LB and B46 bands, crucial for maximizing data throughput and connectivity reliability. Furthermore, the module supports extensive GNSS capabilities, including GPS, GLONASS, Galileo, and BeiDou. The interface board’s purpose is to make these advanced functionalities accessible for testing and development in a controlled environment when paired with the Telit EVB 2.0.

As a core part of the developer ecosystem for the Telit FN990, the interface board ensures that developers can focus on application-level coding and system integration rather than complex hardware translation challenges. The design incorporates the necessary physical interface for the Telit module, preparing it for connectivity to external peripherals and testing equipment via the EVB 2.0. This systematic approach to development reduces time-to-market for products leveraging high-speed 5G connectivity, positioning the FN990 Interface TLB Rev. C w/o module as a foundational tool for next-generation IoT and cellular communication products. Its role as a bridge between the core modem technology and the evaluation platform is indispensable for validating performance metrics and ensuring compliance before final product deployment.

Additional information

Weight 0.2 lbs
Dimensions 1.18 × 2.05 × 0.09 in
Tariff COO

United States

Included Items

Telit FN990 Interface TLB Rev. C, RF SMA connectors

Brand

Telit Cinterion

Model Number

3990252325

Dimensions

30 mm × 52 mm × 2.25 mm (1.18 in. × 2.05 in. × 0.09 in.)

Temperature

Operating: –40 °C to 85 °C (–40 °F to 185 °F)

Product Family

Telit Cinterion® Modules

Product Type

Dev Kit

Device Form Factor

Module: M.2 (NGFF)

Cellular Technology

5G with Fallback

4G/LTE/3G Frequency Band

Band 1 (2100 MHz), Band 2 (1900 MHz), Band 3 (1800 MHz), Band 4 (AWS: 1700/2100 MHz), Band 5 (850 MHz), Band 7 (2600 MHz), Band 8 (900 MHz), Band 12 (700 MHz), Band 13 (700 MHz), Band 14 (700 MHz), Band 17 (700 MHz), Band 18 (850 MHz), Band 19 (850 MHz), Band 20 (800 MHz), Band 25 (1900 MHz), Band 26 (850 MHz), Band 28 (700 MHz), Band 29 (700 MHz), Band 30 (2300 MHz), Band 32 (1500 MHz), Band 34 (2000 MHz), Band 38 (2600 MHz), Band 39 (1900 MHz), Band 40 (2300 MHz), Band 41 (2500 MHz), Band 42 (3500 MHz), Band 43 (3700 MHz), Band 46 (5200 MHz), Band 48 (3500 MHz), Band 66 (1700/2100 MHz), Band 71 (600 MHz)

5G Frequency Band

Band N29 (700 MHz), Band N1 (2100 MHz), Band N2 (1900 MHz), Band N3 (1800 MHz), Band N5 (850 MHz), Band N7 (2600 MHz), Band N8 (900 MHz), Band N12 (700 MHz), Band N13 (700 MHz), Band N14 (700 MHz), Band N18 (700 MHz), Band N20 (800 MHz), Band N25 (1900 MHz), Band N26 (850 MHz), Band N28 (700 MHz), Band N30 (2300 MHz), Band N38 (2600 MHz), Band N40 (2300 MHz), Band N41 (2500 MHz), Band N48 (3500 MHz), Band N66 (1700/2100 MHz), Band N71 (600 MHz), Band N75 (1500 MHz), Band N76 (1500 MHz), Band N77 (3700 MHz), Band N78 (3500 MHz), Band N79 (4700 MHz)

Carrier

Global

Carrier Approvals

AT&T, FirstNet, KDDI, T-Mobile, Telstra, Verizon

Coverage Region

Global

Features

5G sub-6 FDD and TDD, SA and NSA operations, 5G core network Opt. 3a/3x and Opt., 4G 7xCA up to 20 layers DL/ 2xCA UL, 256-QAM DL/UL, 3G HSPA+ Rel 8 (42 DL/11 UL Mbps), Standard M.2 (NGFF) data card form factor, GNSS: GPS, GLONASS, Galileo and BeiDou support

Frequency

5G: n1/n2/n3/n5/n7/n8/n12/n13/n14/n18/n20/n25/n26/n28/n29/n30/n38/n40/n41/n48/n66/n71/n75/n76/n77/n78/n79;4G LTE: B1/B2(B25)/B3/B4(B66)/B26(B5, B18, B19)/B7/B8/B12(B17)/B13/B14/B20/B28/B29(DL)/B30/B32(DL)/B34/B38/B39/B40/B41/B42/B43/B46(LAA)/B48(CBRS)/B66/B71;3G: HSPA+ Rel 8 (42 DL/11 UL Mbps)

Chipset

Qualcomm

Power

LTE/5G Sub-6 Output Power: 23 dBm (Power Class 3), 26 dBm (Power Class 2 in B41/n41), Supply Voltage: Nominal: 3.3 V dc

I/O Interface

SIM Interface, USB 3.1 Gen 2, PCIe Gen3

RF Connector

RF

Accessory Type

Interface Adapter

Interface Connector

M.2 Card, USB 3.1, USB 2.0, PCIe 3.0

Operating System Support

Windows, Linux